IC & Sensor Packaging Technology EXPO - ISP

Product shot

Event Summary

Event Logo
Date:
17-19 Jan 2018
Location:

Tokyo Big Sight, Tokyo, Japan

Name:

Gathers a Wide Variety of Packaging Technologies for IC Devices

Website:
Visit Event Website
Email:
Contact Event Team
Frequency

Annual

Next Event

Jan 2019

Event Edition

19

Organising Office

Reed Exhibitions Japan Ltd, Japan

Industry Sector

Electronics & Electrical Engineering

Price
Space Only: On Request
Space & Shell: On Request

About the Event

A gathering of all kinds of products, technologies and services that can contribute to the miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS.

Products & Services

  1. Assembly Equipment
  2. Packaging Materials
  3. Packaging Components
  4. Semiconductor Device Inspection
  5. Testing Zone
  6. SATS
  7. Contract Design Services Zone
  8. IC Design
  9. Assembly & Testing Services
  10. Plating Zone
  11. Etching Zone
  12. Surface Treatment
  13. Finishing Technologies
  14. Semiconductors
  15. PCBs
  16. Electronic Devices
  17. Plating Materials
  18. Chemicals
  19. Equipment
  20. Substrate
  21. Substrate Zone
  22. Materials for Substrate
  23. Various Software
  24. Various IC Packages
  25. Analysis Software
  26. Simulation Software for IC Packaging
  27. MEMS Devices

Visitor Profile

  1. Semiconductor Manufacturers
  2. Set Manufacturers (in high-density SMT)
  3. Assembly Manufacturers/SATS
  4. LED Manufacturers
  5. Sensor Manufacturers
  6. Automotive Electronics Manufacturers

Other Events in this Sector

See all Events in this Sector

We use cookies to operate this website and to improve its usability. Full details of what cookies are, why we use them and how you can manage them can be found by reading our Privacy & Cookies page. Please note that by using this site you are consenting to the use of cookies.