IC & Sensor Packaging Technology EXPO - ISP

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Event Summary

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17-19 Jan 2018

Tokyo Big Sight, Tokyo, Japan


Gathers a Wide Variety of Packaging Technologies for IC Devices

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Jan 2019

Event Edition


Organising Office

Reed Exhibitions Japan Ltd, Japan

Industry Sector

Electronics & Electrical Engineering

Space Only: On Request
Space & Shell: On Request

About the Event

A gathering of all kinds of products, technologies and services that can contribute to the miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS.

Products & Services

  1. Assembly Equipment
  2. Packaging Materials
  3. Packaging Components
  4. Semiconductor Device Inspection
  5. Testing Zone
  6. SATS
  7. Contract Design Services Zone
  8. IC Design
  9. Assembly & Testing Services
  10. Plating Zone
  11. Etching Zone
  12. Surface Treatment
  13. Finishing Technologies
  14. Semiconductors
  15. PCBs
  16. Electronic Devices
  17. Plating Materials
  18. Chemicals
  19. Equipment
  20. Substrate
  21. Substrate Zone
  22. Materials for Substrate
  23. Various Software
  24. Various IC Packages
  25. Analysis Software
  26. Simulation Software for IC Packaging
  27. MEMS Devices

Visitor Profile

  1. Semiconductor Manufacturers
  2. Set Manufacturers (in high-density SMT)
  3. Assembly Manufacturers/SATS
  4. LED Manufacturers
  5. Sensor Manufacturers
  6. Automotive Electronics Manufacturers

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